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우리가 가장 좋아하는 게임 CPU 는 오늘날 저렴한 가격으로 제공됩니다. Newegg는  프로모션 코드 EMCTDTE24 와 함께 440 달러에 찢어 짖는 Intel Core i9-9900KF를 일반적인 480 달러에서 판매하고 있습니다.
인텔 프로세서, 특히 고급 플래그쉽 CPU에 대한 거래는 자주 발생하지 않지만, 이는 매년 FantasTech 판매 기간 동안이 프로세서에 제공되는 Newegg와 동일한 가격입니다. 아마존은 현재이 프로세서를 480 달러에 판매하고있다. 이 코드는 Newegg의 일일 메일러에서 제공되므로 거래를 시작하기 전에 소매 업체의 메일 링리스트에 가입해야 할 수도 있습니다.
이것은 Core i9-9900K의 "F"변형으로, 통합 그래픽과 함께 제공되지 않습니다. 표준 PC를 제작하는 사람에게는 좋지 않지만, 열성적인 게이머에게는이 CPU를 구입하는 것이 중요하지 않습니다. 의심 할 여지없이 개별 그래픽 카드 와 쌍을 이룰 것 입니다. 시스템에 그래픽 카드가 없으면 디스플레이에 아무것도 표시되지 않습니다.
Core i9-9900KF는 기본 클럭 3.6GHz, 부스트 5.0GHz의 8 코어 16 스레드 프로세서입니다. 이 프로세서는 놀라운 프로세서이며 12 코어 Ryzen 9 3900X와 같은 AMD Ryzen CPU에서 더 저렴한 옵션을 찾을 수 있지만  Core i9-9900K는 여전히 순수한 게임에서 이길 수있는 CPU입니다.
코어 제품군의 가장 큰 장점 중 하나는 인텔의 다중 코어 향상 기능에서 비롯되며 대부분의 고급 마더 보드에서 다양한 수준으로 지원됩니다. 우리는 MCE가 활성화 된 많은 작업 부하에서 Core i9-9900K의 모든 코어가 최대 5GHz까지 크랭크됨을 발견했습니다. 일반적으로 Intel CPU에서는 단일 코어가 최고 부스트 속도에 도달하고 다른 코어는 그 아래로 작동합니다. 5GHz에서 작동하는 모든 코어는 성능에 큰 차이를 만들어냅니다. 이것이 우리가 게임을 좋아하는 이유 중 하나입니다. 이 프로세서는 얼굴을 녹입니다.
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AMD Zen 3 design finalised on 10% faster 7nm+ node


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AMD Zen 2 only just launched and we’re already talking up Zen 3… the cycle never ends. But that’s great for us PC hardware enthusiasts, and AMD has officially announced that the Zen 3 architecture design has been finalised on the 7nm+ process node ready for its expected 2020 launch.
The confirmation comes from AMD’s recent 2nd gen EPYC launch event (via TechPowerUp). The slides suggest there will be no more intermediary steps in its architecture nomenclature, as has previously been the case – such as the shift from Zen to Zen+. It would appear the shift from 7nm to 7nm+ has been deemed worthy of the Zen 3 title. But while that may imply its a more significant step up on Zen 2 than Zen+ was to Zen, there has never been any mention of Zen 2+, so it’s not like anything appears to have changed over at the red camp.
TSMC’s 7nm+ would be able to offer a performance increase inline with AMD’s previous Ryzen refresh of around 10% according to the pure-play foundry. TSMC’s refined 7nm node, N7+, will utilise extreme ultraviolet lithography, or EUV. Using a short 13.5nm wavelength, EUV is intended to speed up semiconductor manufacturing by reducing the necessary masking and processes required by longer wavelengths to create today’s minuscule processors.
A Zen 2 refresh on the new node seems the likely direction for team red, instead leaving the big changes to Zen 4 in 2021. But we can’t say for sure just yet. Over at AMD’s EPYC launch event the company also confirmed the Zen 4 architecture is in design stage, but, seeing as AMD’s confirmed ‘leapfrogging’ design teams in the past, that’s to be expected.


Zen 4 will likely utilise the 6nm process node: a refined variant of the 7nm process node. Yep, process node naming is often gibberish. While TSMC is well on its way to 5nm, the 6nm node may make for a better fit for AMD as it follows all the same design rules as the 7nm node it currently employs with Zen 2.
    More AMD:
  • AMD takes the fight to Intel with 7nm EPYC server CPUs fitted with up to 64-cores
  • AMD CEO Dr. Lisa Su confirms “zero truth” to rumours of her departure and “the best is yet to come”
  • AMD Ryzen 5 3600 review: Ryzen is dead, long live Ryzen!
AMD’s backwards compatibility pledge also ends next year, which will likely see Zen 3 the last to utilise the AM4 socket and Zen 4 the first of a new socket cycle. Maybe it’s time, the AM4 socket has been with us since 2016.
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Samsung cranks up the pressure on Intel’s chip manufacturing dominance in Q2




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Samsung is looking to regain the top spot as the world’s largest semiconductor manufacturer as it closes the gap on current leaders Intel Q2, 2019. Reportedly due to renewed vigor in the memory market (read: less than catastrophic price crashes), the Korean tech giant is slowly easing its recent revenue misses and actually making money in the troubled memory market.
According to IHS Markit (via DigiTimes), Intel still retains the top spot as the biggest, baddest silicon manufacturer around, its revenue of $15.5bn over the last three months securing it the title for the third consecutive quarter. It won this title from Samsung last year when memory prices came crashing down to all-time lows.
NAND flash revenue was in a sharp, 35% decline during Q2, 2018, and SSDs are now cheaper than ever. While it’s still in decline, that decline has now eased to only 5% in 2019. That’s aided Samsung in bandaging its wounds somewhat and posting revenue for the quarter just short of $13bn. It’s still a little way off Intel, but its revenue is finally back on the rise and its got big plans to bolster its business elsewhere.
These plans may crank up the heat on Intel and TSMC, as Samsung recently announced it will be spending ungodly quantities of cash on its contract manufacturing business. The company already has a rather sizeable chip making business, but it hopes on competing head-to-head with the likes of TSMC and net itself some larger clients with its $115bn adrenalin shot. Yep, ungodly.
“Despite the fact that the memory chip market remains pressured by falling prices, weak demand and excess inventory, Samsung in the second quarter managed to find some growth opportunities for its memory products,” Ron Ellwanger, senior analyst at IHS Markit, says. “Samsung has started to see some recovery in NAND and DRAM memory due to strong demand for its high-density products from the mobile and storage segments. NAND sales specifically are benefiting from the higher adoption of solid-state drives in datacentres and from the arrival of new smartphones that have expanded memory content.”
    More Samsung:
  • Samsung C49RG90 review: more than an ultrawide gaming monitor
  • Massive 300-layer Samsung SSD made possible by new “speed-optimised circuit”
  • Despite grabbing Nvidia GPU manufacturing Samsung will never overtake TSMC
And while Intel is finding success in many areas to keep it at the top of the pile, the latest news has AMD’s 2nd gen EPYC processors on a rampage to rid the datacentre of Intel parts. The red team has already announced Google and Twitter will be utilising its chips, and if momentum falls further in its competitors’ favour, Intel could find its place at the top in jeopardy.
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July 30, 2019 AMD has officially released the beta chipset driver to fix boot issues with Destiny 2 on Ryzen 3000 CPUs, alongside a blog post with more in-depth explanation and bug fixes.
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AMD’s Robert Hallock has released a beta chipset driver for AMD Ryzen 3000 processors that fixes Destiny 2 incompatibility issues. This can now be found within the Community Update #5 post on the AMD community website.
When AMD first launched its Ryzen 3000 series processors on July 7, 2019 they were unable to launch Bungie’s most popular title: Destiny 2. The issue was swiftly addressed by both Bungie and AMD on social media, promising a fix in the coming days. That fix would take a little longer, however, as the AGESA update that contained the working code would be pulled due to instability before a wider release.
Rather than wait around too much longer, Robert Hallock, senior technical marketing manager at AMD, has posted a direct link to beta chipset drivers that remedy the issue. These will get a public release very soon, but in the meantime you can download it directly from this Google Drive folder and install it on your machine. You may have to acknowledge a couple of warnings along the way, due to this driver’s beta status, but users are reporting the fix is successful.
“Concerning Destiny 2,” Hallock writes on a Reddit post, “this is indeed something we caught after launch. Plain and simple: I’m sorry. It is not a title that is in our standard test suite, as it’s difficult to reliably benchmark. When we caught it, we sent out a proactive statement to our global press list, about 700 members, resulting in coverage like this. We also collaborated with Bungie support staff to root cause the issue and communicate with their customer support team to let users know what’s up.
“I’m hoping you can help me test a workaround driver that should get you into the game. This is a beta chipset driver, and it may give you an installer warning or two if you’re upgrading an existing driver, but I believe this should work around the D2 launch issue. Can you let me know if it works?”
Earlier in the month, Phoronix noted that issues affecting Destiny 2 may have been one in the same with those causing boot issues on Linux. The issue reportedly lay with the RdRand instruction. This is intended to return random numbers from a random number generator – praise RNGesus – which is crucial to some Linux distros’ boot sequence, and it just so happens Destiny 2 relies on that very instruction, too.
    More AMD:
  • AMD Zen 3 design finalised on 10% faster 7nm+ node
  • AMD takes the fight to Intel with 7nm EPYC server CPUs fitted with up to 64-cores
  • AMD CEO Dr. Lisa Su confirms “zero truth” to rumours of her departure and “the best is yet to come”
The AGESA fix for the issue, alongside other improvements, will launch under the title 1003ABB in the next few weeks, AMD states. Also now available is a new version of Ryzen Master with monitoring and behaviour improvements.
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AutoFull Shield AF063BPU 게임 의자, 확장 세션을위한 제어 및 편의 제공


AutoFull은 중국에서 가장 많이 팔리는 최고의 성능을 자랑하는 게임 의자 브랜드입니다. 또한 국제 게임 프로 리그의 공식 리그 오브 레전드 라이센시 및 공식 게임 의자 브랜드이기도합니다. 이 회사는 현재 주력 제품인 Shield Series AF063BPU의 가격이 미화 $ 220 인 TechPowerUp 독자에게 할인 된 가격으로 전 세계 고객에게 판매를 개시하면서 국제적으로 진출하고 있습니다.

AutoFull Shield 시리즈 AF063BPU는 견고한 쿠션, 어깨 날개, 머리 받침 및 목 뒤 통풍이 가능한 허리 지지대가있는 전체 높이의 회전식 게임 의자입니다. 스위블 스톡의 높이 조절 외에도 높이와 각도 조절이 가능한 팔걸이가 있습니다. 주요 스톡은 순수한 질소 기반 가스 스트럿과 견고한 나일론 피트를 특징으로합니다. 내부에는 시트가 튼튼한 강철 보강재로되어있어 접히는 것을 방지합니다 (대부분의 회전 의자는 목재 파티클 보드 시트로 저렴합니다). 틸트 메커니즘은 최대 150 °의 리 클라인을 처리 할 수 ​​있습니다. 의자는 최대 150kg (330lbs)의 무게를 처리 할 수 ​​있습니다. 

AutoFull Shield AF063BPU 게임 의자 구입

원래 350 달러에 판매 된이 의자는 220 달러에 할인 된 가격으로 제공되지만 TechPowerUp 독자는 AFtech10 % 쿠폰을 사용할 수 있습니다 체크 아웃시 추가 22 달러 할인.


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